Description
0.25mm BGA Reballing Stencils Plate for iPhone PCIE/NAND
●Material: Steel.
●This Stencils Steel Plate is applied to BGA Reballing Rework, to easily and quickly resolder tin on the PCIE/NAND. It is high-temperature resistant that can be heated directly by the hot air gun.
●High precision stencils for iPhone PCIE/NAND Reballing - T0.25mm (75*63mm).
●N.W: 7g.
●Dimensions: 75*63*0.25mm.
SKU#WP0101K386