Description
"AMAOYIXIU" Middle Layer Reballing Stencils Station Kit for iPhone X/XS/XS Max, w/retail package
●The mainboard soldering tool is used to solve the problem of middle layer BGA Reballing Rework for iPhone X/XS/XS Max.
●The middle layer fixture was made of synthetic stone, Anti-static and high temperature-resistant, long service life.
●These Steel Meshes with fine square&round holes make solder paste spread evenly over the mainboard of iPhone X/XS/XS Max.
●Equipped with a magnet base and strong adsorption design is easy to disassemble that makes your maintenance more efficient.
●Fixing columns secure your repair work without worrying the malposition of reballing stencils modules.
●Added heat insulation board:
1. Made of high temperature resistant glass fiber material, when the X main board is tinned, because the middle is suspended too much, it is easy to fall when tweezers press the middle of the stencil. Place this insulation board in the middle of the main board to reduce the suspended position and prevent falling.
2. Heat insulation, some solder balls need to be blown back into place after BGA Reballing Rework, which can protect the chip.
●Separating tin cover for iPhone X, to solve the problem of SIM card sticking tin at BGA Reballing Rework for iPhone X mainboard, 304 stainless steel is custom-made, the size is just right, and the tin is not sticky when heated.
●Contents: 1* Middle Layer Fixture, 1* Magnet Base, 2* Steel Meshes, 2* Heat Insulation Boards, 1* Separating Tin Cover, 2* Tin Scraping Blade
●Middle Layer Fixture Weight:31g
●Magnet Base Weight:184g
●Middle Layer Fixture Size:80*60*5mm
●Magnet Base Size:85*85*11mm
●Gross Weight:240g
●Packing Size:98*90*25mm
SKU#WP0118K024